Microelectronic Design and Fabrication
Fundamentals and Applications of Packaging, RF Design, Micro/Nano Sensors, and Semiconductor LasersBy Ji-Won Baek
Length15h 40m
About this audiobook
A transistor model is only as good as the process that made the device.
Most books split microelectronics into separate worlds: circuit design on one side, fabrication and packaging on the other. This book keeps them in the same conversation. You begin with carrier physics and junction behaviour, build bipolar and MOSFET models from that foundation, and then design single-stage amplifiers, differential pairs, current mirrors and compensated op-amps, with feedback stability and noise treated properly rather than as an afterthought. CMOS digital chapters cover delay, power and standard cells, so the analog and digital paths stay connected.
From there you follow the wafer. Lithography, etch, implant, deposition and planarisation are presented alongside the design decisions they constrain: layout matching, electrostatic discharge protection, parasitic extraction and yield. Packaging is covered from wire bond to through-silicon vias and thermal paths, because a device that cannot be cooled or connected is not a finished product. Radio frequency chapters cover matching, scattering parameters, amplifiers, mixers and oscillators, and later chapters extend the same discipline to micromachined sensors, semiconductor lasers, and test and reliability. The result is a single arc from physics to a working, packaged, characterised part.
What you will learn:
• Semiconductor physics for designers: carriers, junctions and the behaviour that device models must capture
• Diode and bipolar transistor operation, and MOSFET models used in real design work
• Single-stage amplifiers, differential pairs, current mirrors and compensated op-amps
• Frequency response, feedback stability and noise analysis
• CMOS digital circuits: delay, power and standard cells
• Fabrication processes: lithography, etch, implant, deposition and planarisation
• Layout, design rules, matching, ESD protection, parasitic extraction and yield
• Packaging and three-dimensional integration, from wire bond to through-silicon vias and thermal paths
• RF and microwave design, micro and nano sensors, optoelectronic devices, and test, characterisation and reliability
For graduate students and engineers moving into device and integration work, this book is written for readers who need to reason across the whole chain rather than specialise in one link. If you design circuits and want to understand the process that limits them, or you work in fabrication and packaging and want to know what the circuit demands, the material is arranged to meet you where you are and carry you toward integration-level judgement.
Audiobook details
GenreTechnology
Length15 hrs 40 mins
Narrated byListen with 1,000+ voices
FormateBook with Audio
Publish dateSep 27, 2026
LanguageEnglish
Table of contents
1Microelectronic Design and Fabrication
2Foreword
3Preface
4About This Book
5Chapter 1: Semiconductor Physics for Designers
Show all chaptersShow less
61.1 Silicon, Bonds and Carrier Statistics
71.2 Doping, Fermi Level and Carrier Concentration
81.3 Drift, Mobility and Resistivity
91.4 Diffusion, Einstein Relation and Total Current
101.5 Generation, Recombination and the pn Junction
11Chapter 2: Diodes and Bipolar Transistors
122.1 The Diode Equation and Its Temperature Behaviour
132.2 Junction Capacitance, Breakdown and Switching
142.3 Bipolar Transistor Operation and Regions
152.4 Biasing and Thermal Stability
162.5 Small-Signal Hybrid-Pi Model
17Chapter 3: MOSFET Operation and Models
183.1 MOS Capacitance and Threshold Voltage
193.2 Triode, Saturation and Channel-Length Modulation
203.3 Body Effect and Device Symmetry
213.4 Subthreshold Conduction and Leakage
223.5 Short-Channel Effects
23Chapter 4: Single-Stage Amplifiers
244.1 Small-Signal Models and Parameter Extraction
254.2 Common-Source Stage with Resistive and Active Loads
264.3 Common-Gate and Source-Follower Stages
274.4 Cascode Stages and Output Swing
28Chapter 5: Differential Pairs, Current Mirrors and Op-Amps
295.1 Differential Pair Operation and Gain
305.2 Current Mirrors and Accuracy
315.3 Two-Stage Op-Amp Design
325.4 Offset, Compensation and Common-Mode Range
33Chapter 6: Frequency Response, Feedback and Noise
346.1 Poles, Zeros and the Miller Effect
356.2 Bode Plots, Phase Margin and Compensation
366.3 Feedback Topologies and Loop Gain
376.4 Thermal, Shot and Flicker Noise
38Chapter 7: CMOS Digital Circuits
397.1 Inverter Transfer Characteristic and Noise Margins
407.2 Propagation Delay and Logical Effort
417.3 Dynamic and Leakage Power
427.4 Standard Cells, Timing and Design Rules
43Chapter 8: Semiconductor Fabrication Processes
448.1 Crystal Growth, Wafering and Oxidation
458.2 Photolithography and Patterning
468.3 Etching and Pattern Transfer
478.4 Ion Implantation, Annealing and Dopant Activation
488.5 Deposition, Planarisation and Process Integration
49Chapter 9: Layout, Design Rules and Parasitics
509.1 Design Rules, Floorplanning and Layout Practice
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